TED 481922-2026 Wafer Bonder for oxidfree bonding process - PR941467-3340-P (ENAS-05)
Daten und Ressourcen
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PDF für 481922-2026PDF
PDF-Datei zu TED Notice 481922-2026 (NAS)
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XML für 481922-2026XML
XML-Datei zu TED Notice 481922-2026 (NAS)
Zusätzliche Informationen
| Feld | Wert |
|---|---|
| Zuletzt aktualisiert | August 15, 2026, 20:15 (UTC) |
| Erstellt | August 15, 2026, 20:15 (UTC) |
| buyer_city | München |
| buyer_country | DEU |
| buyer_name | Fraunhofer-Gesellschaft - Einkauf B12 |
| contract_type | goods |
| cpv_codes | 31712100 |
| cpv_main | 31712100 |
| document_type | can-standard |
| estimated_value | -1.0 |
| estimated_value_currency | EUR |
| language | DEU |
| notice_title | Wafer Bonder for oxidfree bonding process - PR941467-3340-P (ENAS-05) |
| notice_version | 1 |
| nuts | DE212 |
| procedure_id | 1d2f3aa7-20e5-44bc-84a3-d6213b80833d |
| procedure_type | neg-w-call |
| publication_date | 2026-07-13 |
| publication_number | 481922-2026 |